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ASTM D352 Standard Test Methods for Pasted Mica Used in Electrical Insulation

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ASTM D352电绝缘用涂浆云母标准试验方法
ASTM D352 Standard Test Methods for Pasted Mica Used in Electrical Insulation
ASTM D352电绝缘用涂浆云母标准试验方法
This test determines the compressive creep under laboratory conditions or under conditions that may be encountered during manufacture of electrical equipment. It has special significance if the material to be tested is applied as commutator segment insulation. It serves as a measure under specified  conditions of the ability of the material to resist deformation while under compressive load, during exposure to elevated temperature for a specified time. This test is suitable for acceptance tests and for manufacturing control.
1. Scope
1.1 These test methods cover the testing of bonded mica splittings and bonded mica paper to be used for commutator insulation, hot molding, heater plates, and other similar insulating purposes.
1.2 These test methods appear in the following sections:
Compressive Creep
Dielectric Strength
Mica or Binder Content
Molding Test
Organic Binder
Silicone Binder
Stability Under Heat and Pressure
1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. See 40.1 and 45.1 for specific hazard statements.
1.4 The values stated in inch-pound units are to be regarded as standard. The values given in parentheses are mathematical conversions to SI units that are provided for information only and are not considered standard.

2. Referenced Documents (purchase separately)
ASTM Standards
D149 Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies
D257 Test Methods for DC Resistance or Conductance of Insulating Materials
D1711 Terminology Relating to Electrical Insulation
Index Terms
binder content; bonded mica paper; bonded mica splittings; commutator segment insulation; compressive creep; heater plates; pasted mica; Binder content; Commutator insulation; Compression testing--electrical insulating materials; Creep; Dielectric breakdown voltage; Electrical resistance/resistivity--insulating materials; Heater plates; Heat stability; Hot molding; Mica; Molding test; Organic binder; Pasted mica; Silicone binder; Stability;
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